SMT production process

The compilation of production procedures requires the following types of data, the compilation needs to be performed in the following order.

PWB / Stencil Data input → Printing condition data input

(Printer Condition Data) → Check data input

(Inspection Data) → Cleaning Data → (Solder Paste) Supplemental Data Input

Dis (Dispensation Data) The above data needs to be compiled with one item (PWB stencil data), two items (printing condition data) four items (cleaning data).

1. Data input: Activate menu selection with ALT key

2, Data Input

3. PWB / Stencil Data. At this time, a screen for entering PWB board / network board data will pop up. The data to be entered in this screen are:

1) PWB ID ---- The code of the currently produced PWB.

2) PWB size (X, Y) --- the length width of PWB currently produced.

3) Layout offset (X, Y) ---- The offset of the current production PWB (generally refers to the lower right corner of the PWB).

4) Thickness (Z) ----- The thickness of the currently produced PWB board.

5) Stencil ID ---- The code of the current network board.

6) Stencil size (X, Y) --- the length width of the screen.

7) Printer layout standard ---- the mode of the deviation standard of the current printing.

8) Origin offset (X, Y) ----- the deviation between the PWB reference point the stencil reference point.

9) PWB type ----- PWB type in the selection box.

10) BOC mark NO.1 (X, Y) ---------- PWB stencil deviation correction-coordinate of recognition point.

11) BOC mark NO.2 (X, Y) ------- PWB stencil deviation correction 2 Coordinates of recognition points.

12) The asterisk after SOC mark NO.1, SOC mark NO.2, BOC mark NO.1, BOC mark NO.2 indicates the identification information of the recognition point.