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Laser plate splitter equipment

2020-02-10
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Laser plate splitter equipment
Detailed introduction:

Laser plate splitter equipment

Laser splitter equipment introduction


Brand: LPKF Origin: Germany


PCB laser cutting machine can cut V-CUT for various types; stamp hole PCB circuit board cutting  molding  window opening; cover opening; sub-board for packaged circuit board; sub-board for ordinary light board etc. Suitable for soft  hard board, FR4.PCB.FPC.Fingerprint identification module; cover film; composite material; copper substrate  other materials; PCB circuit board laser cutting; sub-board


High accuracy: The combination of low drift galvanometer  fast ironless linear motor system platform can keep fast cutting while maintaining micron precision


Adopt high-precision CCD automatic positioning  focusing, fast  accurate positioning, no manual intervention, simple operation, realize the same type of one-touch mode, greatly improve production efficiency. Automatic galvanometer correction, automatic focus adjustment,  full automation. Laser displacement sensor is used to automatically adjust the height of the focus to the table surface to achieve rapid alignment, saving time  worry.


It has the advantages of good beam quality, small focusing spot, uniform power distribution, small thermal effect, small slit width,  good cutting quality. This is the guarantee of cutting quality.


Power supply: 220V 50 / 60Hz 1.5KVA


Air pressure requirement: above 0.45Mpa; clean  dry


National Hotline

13962439646

Address: No.333 Youbi Road, Zhoushi Town, Kunshan City, Suzhou City
Email: srd@kunshansmt.cn

Suzhou patch processing

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