X-ray detectors use low-energy X-rays to quickly detect objects without damaging them.

The use of high-voltage impact targets to generate X-ray penetration to detect the internal structural quality of electronic components, semiconductor packaging products, the soldering quality of various types of SMT solder joints [1].

Model: XD7500NT

Reference standards: "Acceptance Standards for IPC-A-610E Electronic Assemblies", "GB / T 17359-1998 General Principles of Quantitative Analysis Methods for X-ray Energy Spectrum of Electronic Probes Scanning Electron Microscopes"

Test items:

1. Testing of integrated circuit packaging processes: layer peeling, cracking, voiding wire bonding processes;

2. Printed circuit board manufacturing process inspection: welding wire offset, bridging, open circuit;

3. Weldability test for surface mount technology: detection measurement of solder joint voids;

4. Connection line inspection: open circuit, short circuit, abnormal bad connection defect;

5. Integrity inspection of solder balls in solder ball array packages chip-on-chip packages;

6. High density plastic material cracking metal material inspection;

7, chip size measurement, wire arc measurement, component tin area measurement.