Solder Paste Inspection (Solder Paste Inspection) is an SMT inspection device that uses the principle of optics to calculate the height of the solder paste printed on the PCB board by triangulation. In fact, both the solder paste thickness gauge SPI are the same kind of equipment, but it is customary in China to refer to offline solder paste thickness detection devices collectively as "solder paste thickness gauges", the online solder paste thickness detection equipment is called " SPI ". Its role is to be able to detect analyze the quality of solder paste printing detect SMT process defects early. The solder paste thickness test can be divided into 2D measurement 3D measurement.

Product Features of 3D Solder Paste Thickness Tester

1. Windows interface, easy to operate;

2. Measurement values can be recorded, archived printed;

3． The measurement value is accurate;

4． The focal length can be adjusted with the thickness of the circuit board;

5． Compact flexible body, easy to move. Be applicable:

1. Measurement statistical analysis of various thickness, width length;

2. Inspection of solder paste quality control;

3． Dimension measurement after solder paste printing molding;

4． The same applies to the measurement inspection of other items within the permitted measurement range; Function:

1. Measure thickness, length, width, pitch, diameter, angle;

2. Provide height distribution values;

3． Analysis control of different solder paste thicknesses;

4． Single-point multi-point lists of measurement results;

5． X-Bar control chart, Range control chart;

6. Cp, Cpk control charts statistical reports.