CM101-D Panasonic chip mounter

New feature Panasonic mounter with high-quality placement

Expanding the range of components for conventional high-speed placement heads.

Equipped with new functions corresponding to components

The newly developed general-purpose placement head (LS8 nozzle) enables high-speed placement of large components of □ 32mm.

POP, C4 compatible universal transfer device

Excellent interchangeability with CM series products

It can transfer the POP top kit C4 mounting solder, flux, etc. to the protrusions with high accuracy, has excellent versatility.

For expanding production scale, only a small amount of initial investment is needed to expand production in stages.

The modularity of the design ensures the interchangeability with CM series products.

Expand production continuity evolution

Model NM-EJM5B

In addition, with the development of new technology levels accumulated by CM series products, only a small amount of investment is needed to realize the equipment upgrade evolution after delivery.

Model name CM101-D

Mounting accuracy ± 40 μm / chip (Cpk ≧ 1)

Board size (mm) L50 × W50 L460 × W360

High-speed placement head 12 nozzles

Mounting speed 0.144 s / chip (A-2 type)

Mounting accuracy ± 50μm / chip, ± 35μm / QFP

Element size (mm) 0402 chip * 1 L12 × W12 × T6.5

Universal head LS8 nozzle

Mounting speed 0.19 s / chip (A-0 type)

Component size (mm) 0603 chip L100 × W90 × T25 * 6

Element size (mm) 0402 chip * 1 L100 × W50 × T15 * 5

Multifunctional placement head 3 nozzles

Placement speed 0.8 s / QFP (B-0 type)

Mounting accuracy ± 35μm / QFP (Cpk ≧ 1)

Equipment size * 2 (mm) W1530 × D1807 × H1430 * 3

Substrate replacement time Approx. 4.0 s (when no component is mounted on the back)

Power supply Three-phase AC 200, 220, 380, 400, 420, 480 V 1.4 kVA

Air pressure source * 2 0.5MPa, 150L / min (A.N.R.)

Weight * 4 1720 kg