SMT is a surface assembly skill, which is a popular skill craft in the current electronic assembly profession. SMT chip processing mainly means that the components are pasted on the PCB printed with glue solder paste through the bonding equipment, then passed through the soldering furnace. smt patch processing has been recognized by manufacturers for its high assembly density, small electronic products, good high-frequency characteristics.

Since the operation efficiency stable performance of the SMT placement machine bring great advantages to our production, with the SMT placement machine, the production efficiency can be greatly improved high-quality products can be provided to customers. The SMT placement machine wants to be a placement robot, which is a relatively precise automated production equipment, so the SMT placement machine operation precautions need to be understood.

SMT chip processing operations precautions:

1. Before operating the SMT placement machine, you must understand the common labeling of the placement machine;

2. Before the SMT placement machine is turned on, the operator should check the machine;

3. The start-up operation sequence of the SMT placement machine must be strictly implemented; detailed SMT placement machine operation instructions must be available;

4. It is necessary to carry out troubleshooting maintenance work on the SMT placement machine in a timely manner.

SMT chip processing advantages:

1.Small electronic products

The volume of chip components is only about 1/10 of that of traditional plug-in components. Generally, after SMT chip processing, the volume of electronic products is reduced by 40% to 60%.

2.Efficacy low cost

SMT chip processing is easy to achieve automation, improve production efficiency, save materials, energy, equipment, manpower, time, etc., reduce costs by 30% to 50%.

3.Light weight

The weight of the chip components is only 10% of the conventional plug-in components. Generally, after using SMT, the weight is reduced by 60% to 80%.

4. High reliability strong anti-vibration ability.

5, good high-frequency characteristics, reducing electromagnetic radio frequency interference.

6. Low solder joint defect rate.