
Model name | High-speed placement machine KE-2070M/KE-2070L/KE-2070E | |
Substrate size | M For substrate (330×250mm) | ○ |
For L substrate(410×360mm) | ○ | |
For E substrate (510×460mm) | ○ | |
Component height | 6mm specifications | ○ |
12mm specifications | ○ | |
20mm specifications | _ | |
25mm specifications | _ | |
Component height | Laser recognition | 0402 (Inch 01005) chip to 33.5mm square element |
Image Identification | 1.0 × 0.5mm ~ 33.5mm square element | |
Component placement speed | condition | 0.155 seconds / chip (23300CPH) |
IC components | 4600CPH* | |
Component placement accuracy | Laser recognition | ±0.05mm |
Image Identification | ±0.04mm | |
Component placement types | Up to 80 types (converted to 8mm tape) | |
power supply | Three-phase AC200 ~ 415V | |
Rated power | 3KVA | |
Use air pressure | 0.5±0.05Mpa | |
Air consumption (standard state) | 345L/Minute | |
Device size(W×D×H) | M substrate | 1,400×1,393×1,455mm |
L substrate | 1,500×1,500×1,455mm | |
E substrate | 1,730×1,600×1,455mm | |
weight | approximately1530kg | |
*: Conversion value when MNVC (optional) all nozzles are used for simultaneous suction. |
13962439646
Address: No. 259 Songjiagang Road, Zhoushi Town, Kunshan City, Suzhou City, Jiangsu Province
Email: srd@kunshansmt.cn