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江苏JUKI-KE-2070

2020-02-09
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江苏JUKI-KE-2070
Detailed introduction:
 Model name
High-speed placement machine KE-2070M/KE-2070L/KE-2070E
 Substrate size   M For substrate (330×250mm)
 For L substrate(410×360mm)
 For E substrate (510×460mm)
 Component height 6mm specifications
 12mm specifications
 20mm specifications
_
25mm specifications
_
 Component height Laser recognition0402 (Inch 01005) chip to 33.5mm square element
 Image Identification
1.0 × 0.5mm ~ 33.5mm square element
 Component placement speedcondition
0.155 seconds / chip (23300CPH)
IC components
4600CPH*
 Component placement accuracy Laser recognition
±0.05mm
Image Identification
±0.04mm
 Component placement types
Up to 80 types (converted to 8mm tape)
 power supply
Three-phase AC200 ~ 415V
 Rated power
3KVA
 Use air pressure
0.5±0.05Mpa
 Air consumption (standard state)
345L/Minute

 Device

size(W×D×H)  

M substrate 
1,400×1,393×1,455mm
L substrate
1,500×1,500×1,455mm
E substrate
1,730×1,600×1,455mm
 weight
 approximately1530kg
*: Conversion value when MNVC (optional)  all nozzles are used for simultaneous suction.

High-speed placement machine KE-2070M

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National Hotline

13962439646

Address: No.333 Youbi Road, Zhoushi Town, Kunshan City, Suzhou City
Email: srd@kunshansmt.cn

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