JUKI-JX-350 Features:

■ Chip components

32,000CPH (condition)

■ Component size

Laser recognition: 0603 ～ 33.5mm square element

Laser head x 1 (6 nozzles)

■ JUKI achieves high-precision, high-quality, high-performance production with its proud laser recognition technology

■ Improving placement quality with component confirmation

■ Longer nozzles are used for interactive suction, enabling high-speed placement of large components with a diameter of 25mm.

■ High-precision placement of the diffuser

■ Can support the industry's large size of 1,500mm

Production of long substrates *

■ High-precision placement of the diffuser

Features of JUKI long substrate high-speed placement machine JX-350:

Chip components: 32,000CPH (conditions)

Element size: laser recognition: 0603 ～ 33.5mm square element

Laser placement head × 1 (6 nozzles)

JUKI achieves high-precision, high-quality, high-performance production with proud laser recognition technology

Improving placement quality with component confirmation

The screw suction nozzle is used for interactive suction, which can realize high-speed placement of large components with a diameter of 25mm.

High-precision placement of the diffuser

Corresponds to the industry's large size of 1,500mm

Production of long substrates

Supports various feeding methods

Corresponds to options

JUKI long substrate high-speed placement machine JX-350 laser recognition features:

JUKI's unique technology supports the quality necessary for future high-density placement

High-precision, high-speed placement

■ Unified identification of high-speed movement

The placement head is equipped with a high-resolution laser sensor, which recognizes the position  angle by reading the shadow formed by the laser irradiation element. Uniform identification during short distance movement to the placement position enables high-speed  high-precision placement of small components such as chip components  SOPs.

High stability

■ Strong identification ability for component deviation

Laser recognition mainly captures the shape of the component  the front side, which can reduce the influence of unstable factors such as the electrode shape  color of the chip component,  ensure stable  high-precision recognition.

Reduce the bad rate

■ Improve component placement quality with component inspection

Using laser recognition can monitor the suction of components through the screen before mounting,  can prevent the poor mounting of small components that cannot be identified by air pressure. Advanced post-placement component inspection  stand-up inspection functions reduce bad mounting.