Product features of JUKI high-speed placement machine KE-3010:

Continuous improvement of KE series products, thus realizing flexible high-speed  high-quality electric production line structure

Chip components

23,500CPH chip (laser identification / condition)

  18,500CPH chip (laser identification / according to IPC9850)

IC components

  9,000CPH IC (image recognition / when using MNVC option)

0402 (Inch 01005) chip to 33.5mm square element

Laser placement head × 1 (6 nozzles)

With electric double-track feeder, it can load up to 160 components.

High-speed continuous image recognition (optional)

Specifications of JUKI high-speed placement machine KE-3010:

Substrate size

M-type substrate (330mm × 250mm)

○

L-shaped substrate (410mm × 360mm)

L-Wide type substrate (510 × 360mm) * 1

XL type substrate (610mm × 560mm)

Long size substrate (M-type substrate specification) * 2

650 × 250mm

Long size substrate (L-shaped substrate specifications) * 2

800 × 360mm

Long size substrate (L-Wide type substrate specification) * 2

1,010 × 360mm

Long size substrate (XL type substrate specification) * 2

1,210 × 560mm

Component height

6mm specifications

12mm specifications

Component size

Laser recognition

Image Identification

Standard camera

 3mm * 3 ～ 33.5mm square element

High Resolution Camera

(Both options)

1.0 × 0.5mm * 4 ～ 20mm square element

Component placement

speed

condition

23,500CPH

IPC9850

18,500CPH

IC component * 5

9,000CPH * 6

Precision

± 0.05mm (Cpk ≧ 1)

± 0.04mm

Component placement types

Up to 160

(Converted to 8mm belt (when using electric double-track belt feeder)) * 7