SMT common name explanation

SMT: surface mounted technology: An assembly technology that directly mounts surface-adhesive components solders them to a specified position on the surface of a printed circuit board.

SMD: surface mounted devices: Surfaces are rectangular pieces, cylindrical rows special shapes, their soldered ends pins are made in the same plane, they are suitable for surface-mounted electronic components.

Reflow soldering (reflow soldering): By remelting the paste-like solder paste previously assigned to the pads of the printed circuit board, the mechanical electrical connection between the surface-attached component terminals pins the pads of the printed circuit board is achieved.

Chip: rectangular chip component: No leads at both ends, soldered ends, a thin, rectangular surface with adhesive components.

SOP: small outline package (small outline package): a small molded plastic package with wing-shaped J-shaped short pins on both sides of a surface-mounted component.

QFP: quad flat pack (quad flat pack): short sides with wing-shaped pins on the four sides, pin pitch: 1.00, 0.80, 0.65, 0.50, 0.40, 0.30mm, etc.

BGA: Ball grid array (ball grid array): The packaging form of integrated circuits, whose input output points are solder balls arranged in a grid pattern on the bottom surface of the component.